Method and apparatus for transferring heat from a substrate to a chuck
A Standard patent application filed on 04 February 2002 credited to Liu, Lianjun ; Mitrovic, Andrej

Details

Application number :

2002236931  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Method and apparatus for transferring heat from a substrate to a chuck  

Inventor :

Liu, Lianjun ; Mitrovic, Andrej  

Agent name :

 

Address for service :

 

Filing date :

04 February 2002  

Associated companies :

 

Applicant name :

TOKYO ELECTRON LIMITED  

Applicant address :

TBS Broadcast Center, 3-6, Akasak 5-chome, Minato-ku, Tokyo 107  

Old name :

 

Original Source :

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