Apparatus and method for electrochemically depositing metal on a semiconductor workpiece
A Standard patent application filed on 07 December 2001 credited to Wilson, Gregory J. ; Chen, Linlin ; Ritzdorf, Thomas L. ; Weaver, Robert A. ; Mchugh, Paul R.

Details

Application number :

2002236571  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Apparatus and method for electrochemically depositing metal on a semiconductor workpiece  

Inventor :

Wilson, Gregory J. ; Chen, Linlin ; Ritzdorf, Thomas L. ; Weaver, Robert A. ; Mchugh, Paul R.  

Agent name :

 

Address for service :

 

Filing date :

07 December 2001  

Associated companies :

 

Applicant name :

Semitool, Inc.  

Applicant address :

 

Old name :

 

Original Source :

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