Multi-chip package with stacked chips and interconnect bumps
A Standard patent application filed on 07 December 1999 credited to Vakilian, Kavous

Details

Application number :

20442  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Multi-chip package with stacked chips and interconnect bumps  

Inventor :

Vakilian, Kavous  

Agent name :

 

Address for service :

 

Filing date :

07 December 1999  

Associated companies :

 

Applicant name :

Viking Components, Inc.  

Applicant address :

 

Old name :

 

Original Source :

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