Method and apparatus for reducing adhesive build-up on ultrasonic bonding surfaces
A Standard patent application filed on 21 December 2001 credited to Laughlin, Barton Andrew ; Betrabet, Chinmay Suresh ; Gaestel, James Melvin ; Nhan, Davis Dang Hoang ; Hoo, Daniel

Details

Application number :

2002231217  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Method and apparatus for reducing adhesive build-up on ultrasonic bonding surfaces  

Inventor :

Laughlin, Barton Andrew ; Betrabet, Chinmay Suresh ; Gaestel, James Melvin ; Nhan, Davis Dang Hoang ; Hoo, Daniel  

Agent name :

 

Address for service :

 

Filing date :

21 December 2001  

Associated companies :

 

Applicant name :

KIMBERLY-CLARK WORLDWIDE, INC.  

Applicant address :

401 N. Lake Street, Neenah, WI 54956  

Old name :

 

Original Source :

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