A packaging system for two-dimensional optoelectronic arrays
A Standard patent application filed on 13 December 2001 credited to Tobey, Alan ; Arsenault, Barry ; Thompson, Rick ; Sundaram, Mani ; Williams, Richard ; Bundas, Jason

Details

Application number :

2002231027  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

A packaging system for two-dimensional optoelectronic arrays  

Inventor :

Tobey, Alan ; Arsenault, Barry ; Thompson, Rick ; Sundaram, Mani ; Williams, Richard ; Bundas, Jason  

Agent name :

 

Address for service :

 

Filing date :

13 December 2001  

Associated companies :

 

Applicant name :

Teraconnect, Inc.  

Applicant address :

 

Old name :

 

Original Source :

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