Subcutaneous injection set tubing with solvent bonding
A Standard patent application filed on 06 November 2001 credited to Nomura, Hiroshi ; Hugo, Robert L. ; Douglas, Joel S.

Details

Application number :

2002230417  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Subcutaneous injection set tubing with solvent bonding  

Inventor :

Nomura, Hiroshi ; Hugo, Robert L. ; Douglas, Joel S.  

Agent name :

 

Address for service :

 

Filing date :

06 November 2001  

Associated companies :

 

Applicant name :

Sterling Medivations, Inc.  

Applicant address :

6025A Unity Drive Norcross, GA 30071 United States of America  

Old name :

 

Original Source :

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