Semiconductor device package and lead frame with die overhanging lead frame pad
A Standard patent application filed on 06 December 2001 credited to Sammon, Tim

Details

Application number :
2002228825  
Application type :
Standard  
Application status :
LAPSED  
Under opposition :
No  
Proceeding type :
 
Invention title :
Semiconductor device package and lead frame with die overhanging lead frame pad  
Inventor :
Sammon, Tim  
Agent name :
 
Address for service :
 
Filing date :
06 December 2001  
Associated companies :
 
Applicant name :
International Rectifier Corporation  
Applicant address :
 
Old name :
 
Original Source :
Go  

Same Inventor