A leadframe and semiconductor package
A Standard patent application filed on 18 October 2001 credited to Wong, Fei Ying ; Chow, Wai Wong ; Ho, Wai Keung ; Cheng, Man Hon

Details

Application number :

2002228773  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

A leadframe and semiconductor package  

Inventor :

Wong, Fei Ying ; Chow, Wai Wong ; Ho, Wai Keung ; Cheng, Man Hon  

Agent name :

 

Address for service :

 

Filing date :

18 October 2001  

Associated companies :

 

Applicant name :

Motorola, Inc.  

Applicant address :

 

Old name :

 

Original Source :

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