Conductor chemical-mechanical polishing in integrated circuit interconnects
A Standard patent application filed on 30 October 2001 credited to Yang, Kai-Yueh ; Avanzino, Steven C. ; Sahota, Kashmir S.

Details

Application number :

2002228751  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Conductor chemical-mechanical polishing in integrated circuit interconnects  

Inventor :

Yang, Kai-Yueh ; Avanzino, Steven C. ; Sahota, Kashmir S.  

Agent name :

 

Address for service :

 

Filing date :

30 October 2001  

Associated companies :

 

Applicant name :

Advanced Micro Devices Inc.  

Applicant address :

 

Old name :

 

Original Source :

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