Liquid curable resin composition with silicone compound
A Standard patent application filed on 29 October 2001 credited to Uchida, Hirofumi ; Komiya, Zen ; Ukachi, Takashi ; Ohara, Hiroki

Details

Application number :

2002224200  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Liquid curable resin composition with silicone compound  

Inventor :

Uchida, Hirofumi ; Komiya, Zen ; Ukachi, Takashi ; Ohara, Hiroki  

Agent name :

 

Address for service :

 

Filing date :

29 October 2001  

Associated companies :

 

Applicant name :

DSM N.V.  

Applicant address :

 

Old name :

 

Original Source :

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