Heat dissipation type semiconductor package and method of fabricating the same
A Standard patent application filed on 08 December 2001 credited to Kim, Young Sun

Details

Application number :
2002222735  
Application type :
Standard  
Application status :
LAPSED  
Under opposition :
No  
Proceeding type :
 
Invention title :
Heat dissipation type semiconductor package and method of fabricating the same  
Inventor :
Kim, Young Sun  
Agent name :
 
Address for service :
 
Filing date :
08 December 2001  
Associated companies :
 
Applicant name :
KIM, Young, Sun  
Applicant address :
101-903 Chungkye Byucksan APT., 258 Hawangsipri-dong, Seungdong-gu  
Old name :
 
Original Source :
Go  

Same Inventor