Details

Application number :
2002221754  
Application type :
Standard  
Application status :
LAPSED  
Under opposition :
No  
Proceeding type :
 
Invention title :
Method for anodic bonding at low temperatures  
Inventor :
Gebhardt, Andreas ; Baier, Volker ; Barth, Stefan  
Agent name :
 
Address for service :
 
Filing date :
26 October 2001  
Associated companies :
 
Applicant name :
Institut Fur Physikalische Hochtechnologie E.V.  
Applicant address :
 
Old name :
 
Original Source :
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