Details

Application number :
2002216373  
Application type :
Standard  
Application status :
LAPSED  
Under opposition :
No  
Proceeding type :
 
Invention title :
Solder foil and semiconductor device and electronic device  
Inventor :
Hata, Hanae ; Miura, Kazuma ; Ishida, Toshiharu ; Soga, Tasao ; Nakatsuka, Tetsuya ; Okamoto, Masahide  
Agent name :
 
Address for service :
 
Filing date :
19 December 2001  
Associated companies :
 
Applicant name :
Hitachi Ltd.  
Applicant address :
 
Old name :
 
Original Source :
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