Polypropylene materials with high melt flow rate and good molding characteristics and methods of making
A Standard patent application filed on 08 October 2001 credited to Kim, Sehyun ; Fujii, Masaki

Details

Application number :
2002211535  
Application type :
Standard  
Application status :
LAPSED  
Under opposition :
No  
Proceeding type :
 
Invention title :
Polypropylene materials with high melt flow rate and good molding characteristics and methods of making  
Inventor :
Kim, Sehyun ; Fujii, Masaki  
Agent name :
 
Address for service :
 
Filing date :
08 October 2001  
Associated companies :
 
Applicant name :
SUNOCO, INC. (R & M)  
Applicant address :
1801 Market Street Philadelphia, PA 19103 United States of America  
Old name :
 
Original Source :
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Same Inventor