Process for packaging high profile products in a modified atmosphere with an upwardly formed heat shrinkable film
A Standard patent application filed on 08 December 1999 credited to Stocklex, H. Walker III
Details
Application number :
19363
Application type :
Standard
Application status :
SEALED
Under opposition :
No
Proceeding type :
Invention title :
Process for packaging high profile products in a modified atmosphere with an upwardly formed heat shrinkable film
Inventor :
Stocklex, H. Walker III
Agent name :
Davies Collison Cave
Address for service :
Level 15 1 Nicholson Street MELBOURNE VIC 3000
Filing date :
08 December 1999
Associated companies :
Applicant name :
Cryovac, Inc.
Applicant address :
P.O. Box 464 100 Rogers Bridge Road Duncan SC 29334 United States Of America