Details
- Application number :
- 2001296417
- Application type :
- Standard
- Application status :
- LAPSED
- Under opposition :
- No
- Proceeding type :
-
- Invention title :
- Enhanced header compression profile
- Inventor :
- Khiem, Le
;
Leon, David
- Agent name :
-
- Address for service :
-
- Filing date :
- 28 September 2001
- Associated companies :
-
- Applicant name :
- Nokia Corporation
- Applicant address :
-
- Old name :
-
- Original Source :
- Go