Low-temperature, heat-activated adhesives with high heat resistance properties
A Standard patent application filed on 18 September 2001 credited to Ley, David A. ; Kobylanska, Irina ; Konkus, David M.

Details

Application number :

2001291053  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Low-temperature, heat-activated adhesives with high heat resistance properties  

Inventor :

Ley, David A. ; Kobylanska, Irina ; Konkus, David M.  

Agent name :

 

Address for service :

 

Filing date :

18 September 2001  

Associated companies :

 

Applicant name :

Cytec Technology Corp.  

Applicant address :

 

Old name :

 

Original Source :

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