Adhesive compositions containing low molecular weight polymeric additives
A Standard patent application filed on 13 September 2001 credited to Ho, Kim Sang ; Lau, Willie ; Van Rheenen, Paul Ralph

Details

Application number :

2001290978  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Adhesive compositions containing low molecular weight polymeric additives  

Inventor :

Ho, Kim Sang ; Lau, Willie ; Van Rheenen, Paul Ralph  

Agent name :

 

Address for service :

 

Filing date :

13 September 2001  

Associated companies :

 

Applicant name :

Rohm And Haas Company  

Applicant address :

 

Old name :

 

Original Source :

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