Mold and mildew inhibiting wicking material
A Standard patent application filed on 10 September 2001 credited to Shah, Dipak J. ; Jones, Gordon W. ; Rohrbach, Ronald P. ; Unger, Peter D. ; Howard, John D

Details

Application number :

2001290709  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Mold and mildew inhibiting wicking material  

Inventor :

Shah, Dipak J. ; Jones, Gordon W. ; Rohrbach, Ronald P. ; Unger, Peter D. ; Howard, John D  

Agent name :

 

Address for service :

 

Filing date :

10 September 2001  

Associated companies :

 

Applicant name :

Honeywell International, Inc.  

Applicant address :

 

Old name :

 

Original Source :

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