Device at packages, coupling members and method for application of a coupling member
A Standard patent application filed on 27 September 2001 credited to Drennow, Sten

Details

Application number :

2001290470  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Device at packages, coupling members and method for application of a coupling member  

Inventor :

Drennow, Sten  

Agent name :

 

Address for service :

 

Filing date :

27 September 2001  

Associated companies :

 

Applicant name :

Asept International AB  

Applicant address :

 

Old name :

 

Original Source :

Go  

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