Details

Application number :
2001289011  
Application type :
Standard  
Application status :
LAPSED  
Under opposition :
No  
Proceeding type :
 
Invention title :
Hermetically sealed component assembly package  
Inventor :
Siu, Paul  
Agent name :
 
Address for service :
 
Filing date :
12 September 2001  
Associated companies :
 
Applicant name :
Datatronic Distribution Incorporated  
Applicant address :
 
Old name :
 
Original Source :
Go  

Same Inventor