Thermocurable electroconductive adhesive sheet, connection structure and connection method using the same
A Standard patent application filed on 07 September 2001 credited to Hirasawa, Yuji ; Kawate, Kohichiro

Details

Application number :

2001288925  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Thermocurable electroconductive adhesive sheet, connection structure and connection method using the same  

Inventor :

Hirasawa, Yuji ; Kawate, Kohichiro  

Agent name :

 

Address for service :

 

Filing date :

07 September 2001  

Associated companies :

 

Applicant name :

3m Innovative Properties Company  

Applicant address :

 

Old name :

 

Original Source :

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