Slurry for use with fixed-abrasive polishing pads in polishing semiconductor device conductive structures that include copper and tungsten and polishing methods
A Standard patent application filed on 30 August 2001 credited to Sinha, Nishant ; Chopra, Dinesh

Details

Application number :

2001288591  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Slurry for use with fixed-abrasive polishing pads in polishing semiconductor device conductive structures that include copper and tungsten and polishing methods  

Inventor :

Sinha, Nishant ; Chopra, Dinesh  

Agent name :

 

Address for service :

 

Filing date :

30 August 2001  

Associated companies :

 

Applicant name :

Micron Technology, Inc.  

Applicant address :

 

Old name :

 

Original Source :

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