In-situ method and apparatus for end point detection in chemical mechanical polishing
A Standard patent application filed on 31 July 2001 credited to Oh, Hilario L. ; Saka, Nannaji ; Nam, Jamie

Details

Application number :

2001279126  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

In-situ method and apparatus for end point detection in chemical mechanical polishing  

Inventor :

Oh, Hilario L. ; Saka, Nannaji ; Nam, Jamie  

Agent name :

 

Address for service :

 

Filing date :

31 July 2001  

Associated companies :

 

Applicant name :

Silicon Valley Group Inc  

Applicant address :

 

Old name :

 

Original Source :

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