Electronic circuit board and soldering method therefor
A Standard patent application filed on 21 February 2000 credited to Okabe, Akira ; Someya, Keisuke

Details

Application number :

18442  

Application type :

Standard  

Application status :

SEALED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Electronic circuit board and soldering method therefor  

Inventor :

Okabe, Akira ; Someya, Keisuke  

Agent name :

SPRUSON & FERGUSON  

Address for service :

GPO Box 3898 SYDNEY NSW 2001  

Filing date :

21 February 2000  

Associated companies :

 

Applicant name :

Canon Kabushiki Kaisha  

Applicant address :

30-2 Shimomaruko 3-chome Ohta-ku Tokyo 146 Japan  

Old name :

 

Original Source :

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