High density three dimensional chip package assembly systems and methods
A Standard patent application filed on 22 May 2001 credited to Rinne, Glenn A. ; Roberson, Mark W. ; Rogers, Vince ; Baldwin, Richard ; Deane, Philip A.

Details

Application number :

2001274890  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

High density three dimensional chip package assembly systems and methods  

Inventor :

Rinne, Glenn A. ; Roberson, Mark W. ; Rogers, Vince ; Baldwin, Richard ; Deane, Philip A.  

Agent name :

 

Address for service :

 

Filing date :

22 May 2001  

Associated companies :

 

Applicant name :

MCNC  

Applicant address :

 

Old name :

 

Original Source :

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