Heat debondable adhesive composition and adhesion structure
A Standard patent application filed on 22 November 1999 credited to Kanki, Tetsuo ; Kawate, Kohichiro

Details

Application number :

18273  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Heat debondable adhesive composition and adhesion structure  

Inventor :

Kanki, Tetsuo ; Kawate, Kohichiro  

Agent name :

 

Address for service :

 

Filing date :

22 November 1999  

Associated companies :

 

Applicant name :

Minnesota Mining and Manufacturing Company  

Applicant address :

 

Old name :

 

Original Source :

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