Molded polymeric material including microcellular, injection-molded, and low-density polymeric material
A Standard patent application filed on 04 November 1999 credited to Pierick, David E.
;
Anderson, Jere R.
;
Laing, Dana E.
;
Chen, Liqin
;
Stevenson, James F.
;
Cha, Sung W.
Details
Application number :
18146
Application type :
Standard
Application status :
LAPSED
Under opposition :
No
Proceeding type :
Invention title :
Molded polymeric material including microcellular, injection-molded, and low-density polymeric material
Inventor :
Pierick, David E.
;
Anderson, Jere R.
;
Laing, Dana E.
;
Chen, Liqin
;
Stevenson, James F.
;
Cha, Sung W.
Agent name :
PIZZEYS
Address for service :
PO Box 291 WODEN ACT 2606
Filing date :
04 November 1999
Associated companies :
Applicant name :
Trexel, Inc.
Applicant address :
45 Sixth Avenue Woburn MA 01801 United States Of America