Mems package with flexible circuit interconnect
A Standard patent application filed on 08 May 2001 credited to Simmons, Richard L.

Details

Application number :

2001264568  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Mems package with flexible circuit interconnect  

Inventor :

Simmons, Richard L.  

Agent name :

 

Address for service :

 

Filing date :

08 May 2001  

Associated companies :

 

Applicant name :

3M INNOVATIVE PROPERTIES COMPANY  

Applicant address :

3M Center, P.O. Box 33427, Saint Paul, MN 55133-3427  

Old name :

 

Original Source :

Go  

Same Inventor

• Hermetic package for mems devices with integrated carrier
• Hermetic mems package with interlocking layers
• Foldable interconnector for conductors
• Hematopoietic facilitatory cells and their uses
• Inducible nitric oxide synthase gene for treatment of disease