Method and apparatus for distributing mold material in a mold for packaging microelectronic devices
A Standard patent application filed on 08 May 2001 credited to Lee, Kian Chai ; Tim, Teoh Bee Yong ; Vijendran, M. ; Choong, Lien Wah

Details

Application number :

2001259681  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Method and apparatus for distributing mold material in a mold for packaging microelectronic devices  

Inventor :

Lee, Kian Chai ; Tim, Teoh Bee Yong ; Vijendran, M. ; Choong, Lien Wah  

Agent name :

 

Address for service :

 

Filing date :

08 May 2001  

Associated companies :

 

Applicant name :

Micron Technology, Inc.  

Applicant address :

 

Old name :

 

Original Source :

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